| PART |
Description |
Maker |
| WEDPS512K32V-XBX WEDPS512K32LV-17BM WEDPS512K32LV- |
512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
|
WEDC[White Electronic Designs Corporation]
|
| WS512K32N-35H1CA WS512K32N-35H1MA WS512K32N-35H1IA |
SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC 静态存储器| 512KX32 |的CMOS |美巡赛| 66PIN |陶瓷
SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC
|
Analog Devices, Inc.
|
| WED7F325ZXE5SJ-A |
512Kx32 5V Flash Module(512Kx32 5V闪速存储器模块) 512Kx32 5V的闪存模块（512Kx32 5V的闪速存储器模块
|
Panasonic, Corp.
|
| TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| EDI8G32512V |
512Kx32 Static RAM CMOS, High Speed Module(512Kx32 高速CMOS静态RAM模块)
|
White Electronic Designs Corporation
|
| PUMA2S16000M-025 PUMA77S16000M-020 PUMA2S16000I-02 |
15NS, 68 PLCC, IND TEMP(EPLD)
SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
15NS, 68 PLCC, COM TEMP(EPLD)
SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC
20NS, 44 PLCC, IND TEMP(EPLD)
30MHZ, 20 PLCC, IND TEMP, GREEN(FPGA)
15NS, TQFP, COM TEMP, ROHS-A(EPLD)
20NS, 44 TQFP, COM TEMP(EPLD)
7NS, 44 TQFP, COM TEMP, GREEN(EPLD)
30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 静态存储器| 512KX32 |的CMOS |美巡赛| 66PIN |陶瓷
|
Intel, Corp.
|
| TH50VSF2580AASB TH50VSF2581AASB |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA[Toshiba Semiconductor]
|
| AT68166H-YM20-E AT68166H-YM20-SCC AT68166H-YM20MQ |
Rad Hard 16 MegaBit 3.3V SRAM Multi-Chip Module
|
ATMEL Corporation
|
| TY00680002/003ADGB |
Pseudo SRAM and NOR Flash Memory Mixed Multi-Chip Package
|
TOSHIBA
|
